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Since 1998 mechatronic has been developing, producing and marketing special machines for the semiconductor industry. In addition, for the past several years mechatronic has been the only company worldwide to offer a unique product portfolio for (contact less) thin wafer handling. Thinwafers can be used in consumer electronics, RFID or in processors, to mention a few examples.
With its thinwafer handling systems, including clean room assembling and clean room services, mechatronic is able to handle thin and ultra thin wafers (>50µm; 150mm, 200mm and 300mm wafer) almost contactless, to flatten warped wafer and to provide additionally high precision centering for lifting, holding, handling and transporting thinwafers. A method for processing both sides of wafers is an additional feature for successful supinating or flipping a wafer. Thus, the company possesses a clear unique selling position: It exclusively uses the patent for Bernoulli-Vacuum End Effectors, which was developed in close cooperation furtheron with Infineon.
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mechatronic bernoulli thinwafer-handling cleanroom-assembling ultrathin-wafer endeffector semi-standards contactless-handling
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Hinzugefügt am 14.04.2010 - 13:30:51 von FIDURA
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http://mechatronic.openflux.de//parteners_read_feed.php?type=public&fid=10&cat=g
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RSS-Feed - Einträge
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mechatronic offers system solutions for 150, 200 and 300 mm wafers suitable for positioning as stand-alone units as well as for modular integration into existing customer equipment as required. mechatronic uses patented Bernoulli vacuum end effectors.
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01.01.1970 - 01:00:00
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http://mechatronic.openflux.de//show_rss_news.php?id=9&fid=10&cat=g
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The Bernoulli Vacuum end effectors are designed for contactless back side handling of 150 mm and 200 mm thin wafers e.g. for handling from the cassette to the pre-aligner
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01.01.1970 - 01:00:00
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http://mechatronic.openflux.de//show_rss_news.php?id=10&fid=10&cat=g
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The top grip end effectors are designed for contactless chip side handling of 150 mm and 200 mm thin wafers e.g. for handling from a pre-aligner to a process chuck or on an inspection table
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01.01.1970 - 01:00:00
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http://mechatronic.openflux.de//show_rss_news.php?id=11&fid=10&cat=g
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The contactless end effectors are designed for chip side & backside handling of 150 mm, 200 mm and 300 mm thin wafers e.g. out of and into a cassette
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01.01.1970 - 01:00:00
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http://mechatronic.openflux.de//show_rss_news.php?id=12&fid=10&cat=g
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The top grip Bernoulli Vacuum end effectors are designed for contactless back side and chip side handling of 150 mm and 200 mm thin wafers
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01.01.1970 - 01:00:00
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http://mechatronic.openflux.de//show_rss_news.php?id=13&fid=10&cat=g
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The eWLB end effectors are designed for contactless back side handling of 200 mm silicon and eWLB wafers for all handling procedures
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01.01.1970 - 01:00:00
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http://mechatronic.openflux.de//show_rss_news.php?id=14&fid=10&cat=g
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The batch end effectors are designed for back side handling of 150 mm and 200 mm thin wafers for handling from one cassette to the other, 13 wafers at once
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01.01.1970 - 01:00:00
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http://mechatronic.openflux.de//show_rss_news.php?id=15&fid=10&cat=g
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The edge grip end effectors are designed for chip side and back side handling of 150 mm and 200 mm standard and glass wafers
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01.01.1970 - 01:00:00
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http://mechatronic.openflux.de//show_rss_news.php?id=16&fid=10&cat=g
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